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1.6 GHz Clock Distribution IC, Dividers, Delay Adjust, Three Outputs AD9514
FEATURES
1.6 GHz differential clock input 3 programmable dividers Divide-by in range from1 to 32 Phase select for coarse delay adjust 2 independent 1.6 GHz LVPECL clock outputs Additive broadband output jitter 225 fs rms 1 independent 800 MHz/250 MHz LVDS/CMOS clock output Additive broadband output jitter 300 fs rms/290 fs rms Time delays up to 10 ns Device configured with 4-level logic pins Space-saving, 32-lead LFCSP
FUNCTIONAL BLOCK DIAGRAM
RSET VS GND
AD9514
/1. . . /32
LVPECL OUT0 OUT0B
LVPECL CLK CLKB /1. . . /32 OUT1 OUT1B LVDS/CMOS OUT2 SYNCB /1. . . /32 t OUT2B
APPLICATIONS
Low jitter, low phase noise clock distribution Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs High performance wireless transceivers High performance instrumentation Broadband infrastructure ATE
SETUP LOGIC
05596-001
VREF
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
Figure 1.
GENERAL DESCRIPTION
The AD9514 features a multi-output clock distribution IC in a design that emphasizes low jitter and phase noise to maximize data converter performance. Other applications with demanding phase noise and jitter requirements also benefit from this part. There are three independent clock outputs. Two of the outputs are LVPECL, and the third output can be set to either LVDS or CMOS levels. The LVPECL outputs operate to 1.6 GHz, and the third output operates to 800 MHz in LVDS mode and to 250 MHz in CMOS mode. Each output has a programmable divider that can be set to divide by a selected set of integers ranging from 1 to 32. The phase of one clock output relative to another clock output can be set by means of a divider phase select function that serves as a coarse timing adjustment. The LVDS/CMOS output features a delay element with three selectable full-scale delay values (1.5 ns, 5 ns, and 10 ns), each with 16 steps of fine adjustment. The AD9514 does not require an external controller for operation or setup. The device is programmed by means of 11 pins (S0 to S10) using 4-level logic. The programming pins are internally biased to VS. The VREF pin provides a level of VS. VS (3.3 V) and GND (0 V) provide the other two logic levels. The AD9514 is ideally suited for data converter clocking applications where maximum converter performance is achieved by encode signals with subpicosecond jitter. The AD9514 is available in a 32-lead LFCSP and operates from a single 3.3 V supply. The temperature range is -40C to +85C.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c) 2005 Analog Devices, Inc. All rights reserved.
AD9514 TABLE OF CONTENTS
Features .............................................................................................. 1 Applications....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 Clock Input.................................................................................... 3 Clock Outputs ............................................................................... 3 Timing Characteristics ................................................................ 4 Clock Output Phase Noise .......................................................... 5 Clock Output Additive Time Jitter............................................. 8 SYNCB, VREF, and Setup Pins ................................................. 10 Power............................................................................................ 10 Timing Diagrams............................................................................ 11 Absolute Maximum Ratings.......................................................... 12 Thermal Characteristics ............................................................ 12 ESD Caution................................................................................ 12 Pin Configuration and Function Descriptions........................... 13 Terminology .................................................................................... 14 Typical Performance Characteristics ........................................... 15 Functional Description .................................................................. 18 Overall.......................................................................................... 18 CLK, CLKB--Differential Clock Input ................................... 18 Synchronization.......................................................................... 18 Power-On SYNC .................................................................... 18 SYNCB..................................................................................... 18 RSET Resistor ................................................................................ 19 VREF............................................................................................ 19 Setup Configuration................................................................... 19 Divider Phase Offset .................................................................. 22 Delay Block ................................................................................. 22 Outputs ........................................................................................ 23 Power Supply............................................................................... 23 Exposed Metal Paddle ........................................................... 24 Power Management ................................................................... 24 Applications..................................................................................... 25 Using the AD9514 Outputs for ADC Clock Applications.... 25 LVPECL Clock Distribution ..................................................... 25 LVDS Clock Distribution .......................................................... 26 CMOS Clock Distribution ........................................................ 26 Setup Pins (S0 to S10)................................................................ 26 Power and Grounding Considerations and Power Supply Rejection...................................................................................... 26 Phase Noise and Jitter Measurement Setups........................... 27 Outline Dimensions ....................................................................... 28 Ordering Guide .......................................................................... 28
REVISION HISTORY
7/05--Revision 0: Initial Version
Rev. 0 | Page 2 of 28
AD9514 SPECIFICATIONS
Typical (typ) is given for VS = 3.3 V 5%, TA = 25C, RSET = 4.12 k, LVPECL VOD = 790 mV, unless otherwise noted. Minimum (min) and maximum (max) values are given over full VS and TA (-40C to +85C) variation.
CLOCK INPUT
Table 1.
Parameter CLOCK INPUT (CLK) Input Frequency 1 Input Sensitivity1 Input Common-Mode Voltage, VCM Input Common-Mode Range, VCMR Input Sensitivity, Single-Ended Input Resistance Input Capacitance
1
Min 0 1.5 1.3 4.0
Typ
Max 1.6
Unit GHz mV p-p V V mV p-p k pF
Test Conditions/Comments
150 1.6 150 4.8 2
1.7 1.8 5.6
Self-biased; enables ac coupling With 200 mV p-p signal applied; dc-coupled CLK ac-coupled; CLKB ac-bypassed to RF ground Self-biased
A slew rate of 1 V/ns is required to meet jitter, phase noise, and propagation delay specifications.
CLOCK OUTPUTS
Table 2.
Parameter LVPECL CLOCK OUTPUTS (OUT0, OUT1) Differential Output Frequency Output High Voltage (VOH) Output Low Voltage (VOL) Output Differential Voltage (VOD) LVDS CLOCK OUTPUT (OUT2) Differential Output Frequency Differential Output Voltage (VOD) Delta VOD Output Offset Voltage (VOS) Delta VOS Short-Circuit Current (ISA, ISB) CMOS CLOCK OUTPUT (OUT2) Single-Ended Output Frequency Output Voltage High (VOH) Output Voltage Low (VOL) Min Typ Max Unit Test Conditions/Comments Termination = 50 to VS - 2 V
0 VS - 1.1 VS - 1.90 640
VS - 0.96 VS - 1.76 790
1.6 VS - 0.82 VS - 1.52 960
GHz V V mV Termination = 100 differential
0 250 1.125
350 1.23 14
800 450 30 1.375 25 24
MHz mV mV V mV mA
0 VS - 0.1
250 0.1
MHz V V
Output shorted to GND Single-ended measurements; termination open Complementary output on (OUT2B) With 5 pF load @ 1 mA load @ 1 mA load
Rev. 0 | Page 3 of 28
AD9514
TIMING CHARACTERISTICS
CLK input slew rate = 1 V/ns or greater. Table 3.
Parameter LVPECL Output Rise Time, tRP Output Fall Time, tFP PROPAGATION DELAY, tPECL, CLK-TO-LVPECL OUT Divide = 1 Divide = 2 - 32 Variation with Temperature OUTPUT SKEW, LVPECL OUT0 to OUT1 on Same Part, tSKP 1 Both LVPECL Outputs Across Multiple Parts, tSKP_AB 2 Same LVPECL Output Across Multiple Parts, tSKP_AB2 LVDS Output Rise Time, tRL Output Fall Time, tFL PROPAGATION DELAY, tLVDS, CLK-TO-LVDS OUT Divide = 1 Divide = 2 - 32 Variation with Temperature OUTPUT SKEW, LVDS LVDS Output Across Multiple Parts, tSKV_AB2 CMOS Output Rise Time, tRC Output Fall Time, tFC PROPAGATION DELAY, tCMOS, CLK-TO-CMOS OUT Divide = 1 Divide = 2 - 32 Variation with Temperature OUTPUT SKEW, CMOS CMOS Output Across Multiple Parts, tSKC_AB2 LVPECL-TO-LVDS OUT Output Delay, tSKV_C LVPECL-TO-CMOS OUT Output Delay, tSKV_C DELAY ADJUST (OUT2; LVDS and CMOS) S0 = 1/3 Zero Scale Delay Time 3 Zero Scale Variation with Temperature Full Scale Time Delay3 Full Scale Variation with Temperature S0 = 2/3 Zero Scale Delay Time3 Zero Scale Variation with Temperature Full Scale Time Delay3 Full Scale Variation with Temperature Min Typ 60 60 355 395 480 530 0.5 0 Max 100 100 635 710 Unit ps ps ps ps ps/C ps ps ps ps ps ns ns ps/C Optional delay off 230 650 650 1.10 1.15 1.45 1.50 1 865 990 1.75 1.80 ps ps ps ns ns ps/C Optional delay off 300 560 700 790 970 950 1150 ps ps ps B outputs are inverted; termination = open 20% to 80%; CLOAD = 3 pF single-ended 80% to 20%; CLOAD = 3 pF single-ended Optional delay off Termination = 100 differential, 3.5 mA 20% to 80%, measured differentially 80% to 20%, measured differentially Optional delay off Test Conditions/Comments Termination = 50 to VS - 2 V 20% to 80%, measured differentially 80% to 20%, measured differentially
-50
+55 125 125 350 350 1.55 1.60
200 210 1.00 1.05 1.25 1.30 0.9
0.34 0.20 1.7 -0.38 0.45 0.31 5.9 -1.3
ns ps/C ns ps/C ns ps/C ns ps/C
Rev. 0 | Page 4 of 28
AD9514
Parameter S0 = 1 Zero Scale Delay Time3 Zero Scale Variation with Temperature Full Scale Time Delay3 Full Scale Variation with Temperature Linearity, DNL Linearity, INL
1 2 3
Min
Typ 0.56 0.47 11.4 -5 0.2 0.2
Max
Unit ns ps/C ns ps/C LSB LSB
Test Conditions/Comments
This is the difference between any two similar delay paths within a single device operating at the same voltage and temperature. This is the difference between any two similar delay paths across multiple devices operating at the same voltage and temperature. Incremental delay; does not include propagation delay.
CLOCK OUTPUT PHASE NOISE
CLK input slew rate = 1 V/ns or greater. Table 4.
Parameter CLK-TO-LVPECL ADDITIVE PHASE NOISE CLK = 622.08 MHz, OUT = 622.08 MHz Divide = 1 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset >1 MHz Offset CLK = 622.08 MHz, OUT = 155.52 MHz Divide = 4 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset >1 MHz Offset CLK = 622.08 MHz, OUT = 38.88 MHz Divide = 16 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset >1 MHz Offset CLK = 491.52 MHz, OUT = 61.44 MHz Divide = 8 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset >1 MHz Offset Min Typ Max Unit Test Conditions/Comments
-125 -132 -140 -148 -153 -154
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-128 -140 -148 -155 -161 -161
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-135 -145 -158 -165 -165 -166
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-131 -142 -153 -160 -165 -165
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
Rev. 0 | Page 5 of 28
AD9514
Parameter CLK = 491.52 MHz, OUT = 245.76 MHz Divide = 2 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset >1 MHz Offset CLK = 245.76 MHz, OUT = 61.44 MHz Divide = 4 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset >1 MHz Offset CLK-TO-LVDS ADDITIVE PHASE NOISE CLK = 622.08 MHz, OUT= 622.08 MHz Divide = 1 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset CLK = 622.08 MHz, OUT = 155.52 MHz Divide = 4 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset CLK = 491.52 MHz, OUT = 245.76 MHz Divide = 2 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset Min Typ Max Unit Test Conditions/Comments
-125 -132 -140 -151 -157 -158
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-138 -144 -154 -163 -164 -165
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-100 -110 -118 -129 -135 -140 -148
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-112 -122 -132 -142 -148 -152 -155
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-108 -118 -128 -138 -145 -148 -154
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
Rev. 0 | Page 6 of 28
AD9514
Parameter CLK = 491.52 MHz, OUT = 122.88 MHz Divide = 4 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset CLK = 245.76 MHz, OUT = 245.76 MHz Divide = 1 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset CLK = 245.76 MHz, OUT = 122.88 MHz Divide = 2 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset CLK-TO-CMOS ADDITIVE PHASE NOISE CLK = 245.76 MHz, OUT = 245.76 MHz Divide = 1 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset CLK = 245.76 MHz, OUT = 61.44 MHz Divide = 4 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset Min Typ Max Unit Test Conditions/Comments
-118 -129 -136 -147 -153 -156 -158
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-108 -118 -128 -138 -145 -148 -155
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-118 -127 -137 -147 -154 -156 -158
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-110 -121 -130 -140 -145 -149 -156
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-125 -132 -143 -152 -158 -160 -162
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
Rev. 0 | Page 7 of 28
AD9514
Parameter CLK = 78.6432 MHz, OUT = 78.6432 MHz Divide = 1 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset @ 1 MHz Offset >10 MHz Offset CLK = 78.6432 MHz, OUT = 39.3216 MHz Divide = 2 @ 10 Hz Offset @ 100 Hz Offset @ 1 kHz Offset @ 10 kHz Offset @ 100 kHz Offset >1 MHz Offset Min Typ Max Unit Test Conditions/Comments
-122 -132 -140 -150 -155 -158 -160
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
-128 -136 -146 -155 -161 -162
dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz
CLOCK OUTPUT ADDITIVE TIME JITTER
Table 5.
Parameter LVPECL OUTPUT ADDITIVE TIME JITTER CLK = 622.08 MHz LVPECL (OUT0 and OUT1) = 622.08 MHz Divide = 1 CLK = 622.08 MHz LVPECL (OUT0 and OUT1) = 155.52 MHz Divide = 4 CLK = 400 MHz LVPECL (OUT0 and OUT1) = 100 MHz Divide = 4 CLK = 400 MHz LVPECL (OUT0, OUT1) = 100 MHz Divide = 4 CLK = 400 MHz LVPECL (OUT0 or OUT1) = 100 MHz Divide = 4 Other LVPECL = 50 MHz LVDS (OUT2) = 50 MHz CLK = 400 MHz LVPECL (OUT0 or OUT1) = 100 MHz Divide = 4 Other LVPECL = 50 MHz CMOS (OUT2) = 50 MHz LVDS OUTPUT ADDITIVE TIME JITTER CLK = 400 MHz LVDS (OUT2) = 100 MHz Divide = 4 Min Typ 40 Max Unit fs rms Test Conditions/Comments BW = 12 kHz - 20 MHz OUT2 off BW = 12 kHz - 20 MHz OUT2 off Calculated from SNR of ADC method; OUT2 off Calculated from SNR of ADC method; Other LVPECL and OUT2 LVDS at same frequency Calculated from SNR of ADC method;
55
fs rms
215
fs rms
215
fs rms
225
fs rms
230
fs rms
Interferer Interferer Calculated from SNR of ADC method;
300
fs rms
Interferer Interferer Delay off Calculated from SNR of ADC method; OUT0 at same frequency; OUT1 off
Rev. 0 | Page 8 of 28
AD9514
Parameter CLK = 400 MHz LVDS (OUT2) = 100 MHz Divide = 4 Both LVPECL = 50 MHz CMOS OUTPUT ADDITIVE TIME JITTER CLK = 400 MHz CMOS (OUT2) = 100 MHz Divide = 4 CLK = 400 MHz CMOS (OUT2) = 100 MHz Divide = 4 Both LVPECL = 50 MHz DELAY BLOCK ADDITIVE TIME JITTER 1 Delay FS = 1.5 ns Fine Adj. 00000 Delay FS = 1.5 ns Fine Adj. 11111 Delay FS = 5 ns Fine Adj. 00000 Delay FS = 5 ns Fine Adj. 11111 Delay FS = 10 ns Fine Adj. 00000 Delay FS = 10 ns Fine Adj. 11111
1
Min
Typ 350
Max
Unit fs rms
Test Conditions/Comments Calculated from SNR of ADC method
290
fs rms
Interferer(s) Delay off Calculated from SNR of ADC method OUT0 at same frequency; OUT1 off Calculated from SNR of ADC method
315
fs rms
Interferer(s) 100 MHz output; incremental additive jitter 0.71 1.2 1.3 2.7 2.0 2.8 ps rms ps rms ps rms ps rms ps rms ps rms
This value is incremental. That is, it is in addition to the jitter of the LVDS or CMOS output without the delay. To estimate the total jitter, the LVDS or CMOS output jitter should be added to this value using the root sum of the squares (RSS) method.
Rev. 0 | Page 9 of 28
AD9514
SYNCB, VREF, AND SETUP PINS
Table 6.
Parameter SYNCB Logic High Logic Low Capacitance VREF Output Voltage S0 TO S10 Levels 0 1/3 2/3 1 Min 2.7 0.40 2 0.62 VS 0.76 VS Typ Max Unit V V pF V Minimum - maximum from 0 mA to 1 mA load Test Conditions/Comments
0.2 VS 0.55 VS 0.9 VS
0.1 VS 0.45 VS 0.8 VS
V V V V
POWER
Table 7.
Parameter POWER-ON SYNCHRONIZATION 1 VS Transit Time from 2.2 V to 3.1 V POWER DISSIPATION Min Typ Max 35 550 635 680 45 125 85 50 140 190 65 Unit ms mW mW mW mW mW mW mW mW mW mW Test Conditions/Comments See Figure 24. All outputs on. 2 LVPECL (divide = 2), 1 LVDS (divide = 2). No clock. Does not include power dissipated in external resistors. All outputs on. 2 LVPECL (divide = 2), 1 CMOS (divide = 2); at 62.5 MHz out (5 pF load). All outputs on. 2 LVPECL, 1 CMOS (divide = 2); At 125 MHz out (5 pF load). For each divider. No clock. For each output. No clock. No clock. No clock. Single-ended. At 62.5 MHz out with 5 pF load. Single-ended. At 125 MHz out with 5 pF load. Off to 1.5 ns fs, delay word = 60; output clocking at 62.5 MHz.
295 380 410
405 490 525 30 90 50 40 110 150 45
POWER DELTA Divider (Divide = 2 to Divide = 1) LVPECL Output LVDS Output CMOS Output (Static) CMOS Output (@ 62.5 MHz) CMOS Output (@ 125 MHz) Delay Block
1
15 65 20 30 80 110 30
This is the rise time of the VS supply that is required to ensure that a synchronization of the outputs occurs on power-up. The critical factor is the time it takes the VS to transition the range from 2.2 V to 3 .1 V. If the rise time is too slow, the outputs will not be synchronized.
Rev. 0 | Page 10 of 28
AD9514 TIMING DIAGRAMS
tCLK
CLK
DIFFERENTIAL 80%
tPECL
LVDS 20%
05596-003 05596-004
tLVDS
05596-002
tRL
tFL
tCMOS
Figure 2. CLK/CLKB to Clock Output Timing, Divide = 1 Mode
DIFFERENTIAL 80% LVPECL 20%
05596-099
Figure 4. LVDS Timing, Differential
SINGLE-ENDED 80% CMOS 3pF LOAD 20%
tRP
tFP
tRC
tFC
Figure 3. LVPECL Timing, Differential
Figure 5. CMOS Timing, Single-Ended, 3 pF Load
Rev. 0 | Page 11 of 28
AD9514 ABSOLUTE MAXIMUM RATINGS
Table 8.
With Respect to GND GND GND CLKB GND GND GND
Parameter or Pin VS RSET CLK CLK OUT0, OUT1, OUT2 FUNCTION STATUS Junction Temperature 1 Storage Temperature Lead Temperature (10 sec)
Min -0.3 -0.3 -0.3 -1.2 -0.3 -0.3 -0.3 -65
Max +3.6 VS + 0.3 VS + 0.3 +1.2 VS + 0.3 VS + 0.3 VS + 0.3 150 +150 300
Unit V V V V V V V C C C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
THERMAL CHARACTERISTICS 2
Thermal Resistance 32-Lead LFCSP 3 JA = 36.6C/W
1 2
See Thermal Characteristics for JA. Thermal impedance measurements were taken on a 4-layer board in still air in accordance with EIA/JESD51-7. 3 The external pad of this package must be soldered to adequate copper land on board.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 12 of 28
AD9514 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
27 OUT0B 32 RSET 29 VS 28 OUT0 31 GND 26 VS 30 VS 25 S0
VS 1 CLK 2 CLKB 3 VS 4 SYNCB 5 VREF 6 S10 7 S9 8
S7 10 S6 11 S2 15 S4 13 S3 14 S8 9 S5 12 S1 16
24 VS 23 OUT1 22 OUT1B
THE EXPOSED PADDLE IS AN ELECTRICAL AND THERMAL CONNECTION
25 24 32
1
AD9514
TOP VIEW (Not to Scale)
21 VS 20 VS 19 OUT2 18 OUT2B 17 VS
05596-005
EXPOSED PAD (BOTTOM VIEW) GND
17 16
9
8
Figure 6. 32-Lead LFCSP Pin Configuration
Figure 7. Exposed Paddle
Note that the exposed paddle on this package is an electrical connection as well as a thermal enhancement. For the device to function properly, the paddle must be soldered to a PCB land that functions as both a heat dissipation path as well as an electrical ground (analog).
Table 9. Pin Function Descriptions
Pin No. 1, 4 ,17, 20, 21, 24, 26, 29, 30 2 3 5 6 7 to 16, 25 Mnemonic VS CLK CLKB SYNCB VREF S10 to S0 Description Power Supply (3.3 V). Clock Input. Complementary Clock Input. Used to Synchronize Outputs; Do Not Let Float. Provides 2/3 VS for Use as One of the Four Logic Levels on S0 to S10. Setup Select Pins. These are 4-state logic. The logic levels are VS, GND, 1/3 VS, and 2/3 VS. The VREF pin provides 2/3 VS. Each pin is internally biased to 1/3 VS so that a pin requiring that logic level should be left no connection (NC). Complementary LVDS/Inverted CMOS Output. LVDS/CMOS Output. Complementary LVPECL Output. LVPECL Output. Complementary LVPECL Output. LVPECL Output. Ground. The exposed paddle on the back of the chip is also GND. Current Sets Resistor to Ground. Nominal value = 4.12 k.
18 19 22 23 27 28 31, Exposed Paddle 32
OUT2B OUT2 OUT1B OUT1 OUT0B OUT0 GND RSET
Rev. 0 | Page 13 of 28
05596-006
AD9514 TERMINOLOGY
Phase Jitter and Phase Noise An ideal sine wave can be thought of as having a continuous and even progression of phase with time from 0 to 360 degrees for each cycle. Actual signals, however, display a certain amount of variation from ideal phase progression over time. This phenomenon is called phase jitter. Although there are many causes that can contribute to phase jitter, one major component is due to random noise that is characterized statistically as being Gaussian (normal) in distribution. This phase jitter leads to a spreading out of the energy of the sine wave in the frequency domain, producing a continuous power spectrum. This power spectrum is usually reported as a series of values whose units are dBc/Hz at a given offset in frequency from the sine wave (carrier). The value is a ratio (expressed in dB) of the power contained within a 1 Hz bandwidth with respect to the power at the carrier frequency. For each measurement, the offset from the carrier frequency is also given. It is also meaningful to integrate the total power contained within some interval of offset frequencies (for example, 10 kHz to 10 MHz). This is called the integrated phase noise over that frequency offset interval and can be readily related to the time jitter due to the phase noise within that offset frequency interval. Phase noise has a detrimental effect on the performance of ADCs, DACs, and RF mixers. It lowers the achievable dynamic range of the converters and mixers, although they are affected in somewhat different ways. Time Jitter Phase noise is a frequency domain phenomenon. In the time domain, the same effect is exhibited as time jitter. When observing a sine wave, the time of successive zero crossings is seen to vary. For a square wave, the time jitter is seen as a displacement of the edges from their ideal (regular) times of occurrence. In both cases, the variations in timing from the ideal are the time jitter. Since these variations are random in nature, the time jitter is specified in units of seconds root mean square (rms) or 1 sigma of the Gaussian distribution. Time jitter that occurs on a sampling clock for a DAC or an ADC decreases the SNR and dynamic range of the converter. A sampling clock with the lowest possible jitter provides the highest performance from a given converter. Additive Phase Noise It is the amount of phase noise that is attributable to the device or subsystem being measured. The phase noise of any external oscillators or clock sources has been subtracted. This makes it possible to predict the degree to which the device affects the total system phase noise when used in conjunction with the various oscillators and clock sources, each of which contribute their own phase noise to the total. In many cases, the phase noise of one element dominates the system phase noise. Additive Time Jitter It is the amount of time jitter that is attributable to the device or subsystem being measured. The time jitter of any external oscillators or clock sources has been subtracted. This makes it possible to predict the degree to which the device will affect the total system time jitter when used in conjunction with the various oscillators and clock sources, each of which contribute their own time jitter to the total. In many cases, the time jitter of the external oscillators and clock sources dominates the system time jitter.
Rev. 0 | Page 14 of 28
AD9514 TYPICAL PERFORMANCE CHARACTERISTICS
0.4
0.6
2 LVPECL (DIV ON)
2 LVPECL (DIV ON) + 1 CMOS (DIV ON)
0.3
POWER (W) POWER (W)
0.5
2 LVPECL (DIV = 1)
0.2
1 LVDS (DIV ON)
0.4
05596-098
2 LVPECL (DIV OFF) + 1 CMOS (DIV OFF) 0.3 0 20 40 60 80 OUTPUT FREQUENCY (MHz) 100 120
0.1 400 800 1200 OUTPUT FREQUENCY (MHz)
1600
Figure 8. Power vs. Frequency--LVPECL, LVDS
Figure 10. Power vs. Frequency--LVPECL, CMOS
START 300kHz
STOP 5GHz
Figure 9. CLK Smith Chart (Evaluation Board)
05596-097
Rev. 0 | Page 15 of 28
05596-096
AD9514
1.8
DIFFERENTIAL SWING (V p-p)
1.7
1.6
1.5
1.4
1.3
05596-095
05596-012
VERT 500mV/DIV
HORIZ 200ps/DIV
1.2 100
600
1100
1600
OUTPUT FREQUENCY (MHz)
Figure 11. LVPECL Differential Output @ 1600 MHz
Figure 14. LVPECL Differential Peak-to-Peak Output Swing vs. Frequency
750
DIFFERENTIAL SWING (mV p-p)
700
650
600
550
05596-013
05596-010
500 100
300
VERT 100mV/DIV
HORIZ 500ps/DIV
500 700 OUTPUT FREQUENCY (MHz)
900
Figure 12. LVDS Differential Output @ 800 MHz
Figure 15. LVDS Differential Peak-to-Peak Output Swing vs. Frequency
3.5 2pF 3.0 2.5
OUTPUT (VPK)
10pF 2.0 1.5 1.0 20pF
05596-011
0 0 100 200 300 400 OUTPUT FREQUENCY (MHz) 500
VERT 500mV/DIV
HORIZ 1ns/DIV
600
Figure 13. CMOS Single-Ended Output @ 250 MHz with 10 pF Load
Figure 16. CMOS Single-Ended Output Swing vs. Frequency and Load
Rev. 0 | Page 16 of 28
05596-014
0.5
AD9514
-110 -110
-120
-120
-130
-130
L(f) (dBc/Hz)
-140
L(f) (dBc/Hz)
05596-015
-140
-150
-150
-160
-160
05596-018
-170 10
100
1k
10k 100k OFFSET (Hz)
1M
10M
-170 10
100
1k
10k 100k OFFSET (Hz)
1M
10M
Figure 17. Additive Phase Noise--LVPECL Divide = 1, 245.76 MHz
-80 -90 -100 -110
Figure 20. Additive Phase Noise--LVPECL Divide = 1, 622.08 MHz
-80 -90 -100 -110
L(f) (dBc/Hz)
-120 -130 -140 -150
05596-016
L(f) (dBc/Hz)
-120 -130 -140 -150 -160 -170 10
05596-019
-160 -170 10
100
1k
10k 100k OFFSET (Hz)
1M
10M
100
1k
10k 100k OFFSET (Hz)
1M
10M
Figure 18. Additive Phase Noise--LVDS Divide = 1, 245.76 MHz
-100 -110
Figure 21. Additive Phase Noise--LVDS Divide = 2, 122.88 MHz
-100 -110
-120
-120
L(f) (dBc/Hz)
-130
L(f) (dBc/Hz)
05596-017
-130
-140 -150 -160
-140 -150 -160
-170 10
100
1k
10k 100k OFFSET (Hz)
1M
10M
-170 10
100
1k
10k 100k OFFSET (Hz)
1M
10M
Figure 19. Additive Phase Noise--CMOS Divide = 1, 245.76 MHz
Figure 22. Additive Phase Noise--CMOS Divide = 4, 61.44 MHz
Rev. 0 | Page 17 of 28
05596-020
AD9514 FUNCTIONAL DESCRIPTION
OVERALL
The AD9514 provides for the distribution of its input clock on up to three outputs simultaneously. OUT0 and OUT1 are LVPECL levels. OUT2 can be set to either LVDS or CMOS levels. Each output has its own divider that can be set for a divide ratio selected from a list of integer values from 1 (bypassed) to 32. OUT2 includes an analog delay block that can be set to add an additional delay of 1.5 ns, 5 ns, or 10 ns full scale, each with 16 levels of fine adjustment.
2.2V 35ms MAX VS CLK OUT CLOCK FREQUENCY IS EXAMPLE ONLY DIVIDE = 2 PHASE = 0 INTERNAL SYNC NODE 0V 3.3V 3.1V
< 65ms
05596-094
Figure 24. Power-On Sync Timing
CLK, CLKB--DIFFERENTIAL CLOCK INPUT
The CLK and CLKB pins are differential clock input pins. This input works up to 1600 MHz. The jitter performance is degraded by a slew rate below 1 V/ns. The input level should be between approximately 150 mV p-p to no more than 2 V p-p. Anything greater can result in turning on the protection diodes on the input pins. See Figure 23 for the CLK equivalent input circuit. This input is fully differential and self-biased. The signal should be accoupled using capacitors. If a single-ended input must be used, this can be accommodated by ac coupling to one side of the differential input only. The other side of the input should be bypassed to a quiet ac ground by a capacitor.
VS CLK CLOCK INPUT STAGE
CLK OUT SYNCB EXAMPLE: DIVIDE 8 PHASE = 0 EXAMPLE DIVIDE RATIO PHASE = 0
SYNCB
If the setup configuration of the AD9514 is changed during operation, the outputs can become unsynchronized. The outputs can be re-synchronized to each other at any time. Synchronization occurs when the SYNCB pin is pulled low and released. The clock outputs (except where divide = 1) are forced into a fixed state (determined by the divide and phase settings) and held there in a static condition until the SYNCB pin is returned to high. Upon release of the SYNCB pin, after four cycles of the clock signal at CLK, all outputs continue clocking in synchronicity (except where divide = 1). When divide = 1 for an output, that output is not affected by SYNCB.
3 CLK CYCLES 4 CLK CYCLES
CLKB 2.5k 5k
05596-021
Figure 25. SYNCB Timing with Clock Present
2.5k
4 CLK CYCLES CLK OUT DEPENDS ON PREVIOUS STATE SYNCB MIN 5ns EXAMPLE DIVIDE RATIO PHASE = 0
05596-092
5k
Figure 23 Clock Input Equivalent Circuit
DEPENDS ON PREVIOUS STATE AND DIVIDE RATIO
SYNCHRONIZATION
Power-On SYNC
A power-on sync (POS) is issued when the VS power supply is turned on to ensure that the outputs start in synchronization. The power-on sync works only if the VS power supply transitions the region from 2.2 V to 3.1 V within 35 ms. The POS can occur up to 65 ms after VS crosses 2.2 V. Only outputs which are not divide = 1 are synchronized.
Figure 26. SYNCB Timing with No Clock Present
The outputs of the AD9514 can be synchronized by using the SYNCB pin. Synchronization aligns the phases of the clock outputs, respecting any phase offset that has been set on a particular output's divider.
SYNCB
05596-022
Figure 27. SYNCB Equivalent Input Circuit
Rev. 0 | Page 18 of 28
05596-093
AD9514
Synchronization is initiated by pulling the SYNCB pin low for a minimum of 5 ns. The input clock does not have to be present at the time the command is issued. The synchronization occurs after four input clock cycles. The synchronization applies to clock outputs: * * that are not turned OFF where the divider is not divide = 1 (divider bypassed)
SETUP PIN S0 TO S10
05596-023
VS
60k
30k
Figure 28. Setup Pin (S0 to S10) Equivalent Circuit
An output with its divider set to divide = 1 (divider bypassed) is always synchronized with the input clock, with a propagation delay. The SYNCB pin must be pulled up for normal operation. Do not let the SYNCB pin float.
The AD9514 operation is determined by the combination of logic levels present at the setup pins. The setup configurations for the AD9514 are shown in Table 10 to Table 15. The four logic levels are referred to as 0, , , and 1. These numbers represent the fraction of the VS voltage that defines the logic levels. See the setup pins thresholds in Table 6. The meaning of some of the setup pins depends on the logic level set on other pins. For example, the effect of the S3 to S4 pair of pins depends on whether S0 = 0. If S0 = 0, the delay block for OUT2 is off, and the logic levels on S3 to S4 set the phase word of the OUT2 divider. However, if S0 0, then the full-scale delay for OUT2 is set by the logic level on S0, and S3 to S4 sets the delay block fine adjust (fraction of full scale). S1 and S2 together determine the logic level of each output or whether a channel is off. An output that is set to OFF is powered down, including the divider. OUT0 and OUT1 are LVPECL. The LVPECL output differential voltage (VOD) can have three possible levels: 410 mV, 790 mV, and 960 mV (limited to the available combinations, see Table 11). OUT2 can be set to either LVDS or CMOS levels. S5 and S6 effect depends on S2. If S2 = 0 (OUT2 is off), S5 and S6 set the OUT1 phase word. If S2 0, S5 and S6 set the OUT2 divide ratio. If S2 = , then the value in S9 and S10 overrides the divide ratio for OUT2. S7 and S8 depend on S2 and S0. If S2 1, these pins set the OUT1 divide ratio. However, if S2 = 1 (OUT1 is off) and S0 0, S7 and S8 set the phase word for OUT2. S9 and S10 depend on S2. If S2 , these pins set the OUT0 divide ratio. If S2 = , they set the OUT2 divide ratio, overriding S5 and S6.
RSET RESISTOR
The internal bias currents of the AD9514 are set by the RSET resistor. This resistor should be as close as possible to the value given as a condition in the Specifications section (RSET = 4.12 k). This is a standard 1% resistor value and should be readily obtainable. The bias currents set by this resistor determine the logic levels and operating conditions of the internal blocks of the AD9514. The performance figures given in the Specifications section assume that this resistor value is used for RSET.
VREF
The VREF pin provides a voltage level of VS. This voltage is one of the four logic levels used by the setup pins (S0 to S10). These pins set the operation of the AD9514. The VREF pin provides sufficient drive capability to drive as many of the setup pins as necessary, up to all on a single part. The VREF pin should be used for no other purpose.
SETUP CONFIGURATION
The specific operation of the AD9514 is set by the logic levels applied to the setup pins (S0 to S10). These pins use four-state logic. The logic levels used are VS and GND, plus VS and VS. The VS level is provided by the internal self-biasing on each of the setup pins (S0 to S10). This is the level seen by a setup pin that is left not connected (NC). The VS level is provided by the VREF pin. All setup pins requiring the VS level must be tied to the VREF pin.
Rev. 0 | Page 19 of 28
AD9514
Table 10. S0--OUT2 Delay
S0 0 1/3 2/3 1 Delay Full Scale Off (Bypassed) 1.5 ns 5 ns 10 ns
Table 12. S3, S4--OUT2 Delay Fine Adjust or Phase
S0 0 OUT2 Delay Fine Adjust (Fraction of FS) 0 1/16 1/8 3/16 1/4 5/16 3/8 7/16 1/2 9/16 5/8 11/16 3/4 13/16 7/8 15/16 S0 = 0 OUT2 Phase 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Table 11. S1, S2--Output Select
S1 0 1/3 2/3 1 0 1/3 2/3 1 0 1/3 2/3 1 0 1/3 2/3 1 S2 0 0 0 0 1/3 1/3 1/3 1/3 2/3 2/3 2/3 2/3 1 1 1 1 OUT0 LVPECL OFF 790 mV 410 mV 960 mV 790 mV 410 mV 410 mV 790 mV OFF OFF OFF OFF 410 mV 790 mV 410 mV 790 mV OUT1 LVPECL 410 mV 790 mV 410 mV 960 mV 790 mV 410 mV 410 mV 790 mV OFF OFF OFF 790 mV OFF OFF OFF OFF OUT2 LVDS/CMOS OFF OFF OFF OFF CMOS LVDS CMOS LVDS OFF LVDS CMOS OFF CMOS LVDS LVDS CMOS
S3 0 1/3 2/3 1 0 1/3 2/3 1 0 1/3 2/3 1 0 1/3 2/3 1
S4 0 0 0 0 1/3 1/3 1/3 1/3 2/3 2/3 2/3 2/3 1 1 1 1
Rev. 0 | Page 20 of 28
AD9514
Table 13. S5, S6--OUT2 Divide or OUT1 Phase
S2 0 OUT2 Divide (Duty Cycle1) 1 2 (50%) 3 (33%) 4 (50%) 5 (40%) 6 (50%) 8 (50%) 9 (44%) 10 (50%) 12 (50%) 15 (47%) 16 (50%) 18 (50%) 24 (50%) 30 (50%) 32 (50%) S2 = 0 OUT1 Phase 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Table 15. S9, S10--OUT0 Divide or OUT2 Divide
S2 2/3 OUT0 Divide (Duty Cycle1) 1 2 (50%) 3 (33%) 4 (50%) 5 (40%) 6 (50%) 8 (50%) 9 (44%) 10 (50%) 12 (50%) 15 (47%) 16 (50%) 18 (50%) 24 (50%) 30 (50%) 32 (50%) S2 = 2/3 OUT2 Divide (Duty Cycle1) 7 (43%) 11 (45%) 13 (46%) 14 (50%) 17 (47%) 19 (47%) 20 (50%) 21 (48%) 22 (50%) 23 (48%) 25 (48%) 26 (50%) 27 (48%) 28 (50%) 29 (48%) 31 (48%)
S5 0 1/3 2/3 1 0 1/3 2/3 1 0 1/3 2/3 1 0 1/3 2/3 1
1
S6 0 0 0 0 1/3 1/3 1/3 1/3 2/3 2/3 2/3 2/3 1 1 1 1
S9 0 1/3 2/3 1 0 1/3 2/3 1 0 1/3 2/3 1 0 1/3 2/3 1
1
S10 0 0 0 0 1/3 1/3 1/3 1/3 2/3 2/3 2/3 2/3 1 1 1 1
Duty cycle is the clock signal high time divided by the total period.
Duty cycle is the clock signal high time divided by the total period.
Table 14. S7, S8--OUT1 Divide or OUT2 Phase
S2 1 OUT1 Divide (Duty Cycle1) 1 2 (50%) 3 (33%) 4 (50%) 5 (40%) 6 (50%) 8 (50%) 9 (44%) 10 (50%) 12 (50%) 15 (47%) 16 (50%) 18 (50%) 24 (50%) 30 (50%) 32 (50%) S2 = 1 and S0 0 OUT2 Phase 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
S7 0 1/3 2/3 1 0 1/3 2/3 1 0 1/3 2/3 1 0 1/3 2/3 1
1
S8 0 0 0 0 1/3 1/3 1/3 1/3 2/3 2/3 2/3 2/3 1 1 1 1
Duty cycle is the clock signal high time divided by the total period.
Rev. 0 | Page 21 of 28
AD9514
DIVIDER PHASE OFFSET
The phase of OUT1 or OUT2 can be selected, depending on the divide ratio and output configuration chosen. This allows, for example, the relative phase of OUT0 and OUT1 to be set. After a SYNC operation (see the Synchronization section), the phase offset word of each divider determines the number of input clock (CLK) cycles to wait before initiating a clock output edge. By giving each divider a different phase offset, output-tooutput delays can be set in increments of the fast clock period, tCLK. Figure 29 shows four cases, each with the divider set to divide = 4. By incrementing the phase offset from 0 to 3, the output is offset from the initial edge by a multiple of tCLK.
0 CLOCK INPUT CLK DIVIDER OUTPUT DIV = 4 PHASE = 0 tCLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
The resolution of the phase offset is set by the fast clock period (tCLK) at CLK. The maximum unique phase offset is less than the divide ratio, up to a phase offset of 15. Phase offsets can be related to degrees by calculating the phase step for a particular divide ratio: Phase Step = 360/Divide Ratio Using some of the same examples: Divide = 4 Phase Step = 360/4 = 90 Unique Phase Offsets in Degrees Are Phase = 0, 90, 180, 270 Divide = 9 Phase Step = 360/9 = 40 Unique Phase Offsets in Degrees Are Phase = 0, 40, 80, 120, 160, 200, 240, 280, 320
PHASE = 1
DELAY BLOCK
PHASE = 2
OUT2 includes an analog delay element that gives variable time delays (T) in the clock signal passing through that output.
PHASE = 3 tCLK
05596-024
CLOCK INPUT OUT2 ONLY
2 x tCLK 3 x tCLK
Figure 29. Phase Offset--Divider Set for Divide = 4, Phase Set from 0 to 2
/N SELECT
MUX
LVDS CMOS OUTPUT DRIVER
For example: CLK = 491.52 MHz tCLK = 1/491.52 = 2.0345 ns For Divide = 4: Phase Offset 0 = 0 ns Phase Offset 1 = 2.0345 ns Phase Offset 2 = 4.069 ns Phase Offset 3 = 6.104 ns The outputs can also be described as: Phase Offset 0 = 0 Phase Offset 1 = 90 Phase Offset 2 = 180 Phase Offset 3 = 270 Setting the phase offset to Phase = 4 results in the same relative phase as Phase = 0 or 360.
T
FINE DELAY ADJUST (16 STEPS) FULL SCALE : 1.5ns, 5ns, 10ns
Figure 30. Analog Delay Block
The amount of delay that can be used is determined by the output frequency. The amount of delay is limited to less than one-half cycle of the clock period. For example, for a 10 MHz clock, the delay can extend to the full 10 ns maximum. However, for a 100 MHz clock, the maximum delay is less than 5 ns (or half of the period). The AD9514 allows for the selection of three full-scale delays, 1.5 ns, 5 ns, and 10 ns, set by delay full scale (see Table 10). Each of these full-scale delays can be scaled by 16 fine adjustment values, which are set by the delay word (see Table 12). The delay block adds some jitter to the output. This means that the delay function should be used primarily for clocking digital chips, such as FPGA, ASIC, DUC, and DDC, rather than for supplying a sample clock for data converters. The jitter is higher for longer full scales because the delay block uses a ramp and trip points to create the variable delay. A longer ramp means more noise has a chance of being introduced.
Rev. 0 | Page 22 of 28
05596-025
AD9514
When the delay block is OFF (bypassed), it is also powered down.
POWER SUPPLY
The AD9514 requires a 3.3 V 5% power supply for VS. The tables in the Specifications section give the performance expected from the AD9514 with the power supply voltage within this range. In no case should the absolute maximum range of -0.3 V to +3.6 V, with respect to GND, be exceeded on Pin VS. Good engineering practice should be followed in the layout of power supply traces and the ground plane of the PCB. The power supply should be bypassed on the PCB with adequate capacitance (>10 F). The AD9514 should be bypassed with adequate capacitors (0.1 F) at all power pins as close as possible to the part. The layout of the AD9514 evaluation board (AD9514/PCB) is a good example.
OUTPUTS
The AD9514 offers three different output level choices: LVPECL, LVDS, and CMOS. OUT0/OUT0B and OUT1/ OUT1B are LVPECL differential outputs. There are three amounts of LVPECL differential voltage swing (VOD) that can be selected (410 mV, 790 mV, and 960 mV) within the choices available in Table 11. OUT2/OUT2B can be selected as either an LVDS differential output or a pair of CMOS single-ended outputs. If selected as CMOS, OUT2 is a noninverted, single-ended output, and OUT2B is an inverted, single-ended output.
3.3V
OUT OUTB
GND
Figure 31. LVPECL Output Simplified Equivalent Circuit
3.5mA
OUT OUTB
3.5mA
Figure 32. LVDS Output Simplified Equivalent Circuit
VS
OUT2/ OUT2B
05596-028
Figure 33. CMOS Equivalent Output Circuit
05596-027
05596-026
Rev. 0 | Page 23 of 28
AD9514
Exposed Metal Paddle
The exposed metal paddle on the AD9514 package is an electrical connection, as well as a thermal enhancement. For the device to function properly, the paddle must be properly attached to ground (GND). The exposed paddle of the AD9514 package must be soldered down. The AD9514 must dissipate heat through its exposed paddle. The PCB acts as a heat sink for the AD9514. The PCB attachment must provide a good thermal path to a larger heat dissipation area, such as a ground plane on the PCB. This requires a grid of vias from the top layer down to the ground plane (see Figure 34). The AD9514 evaluation board (AD9514/PCB) provides a good example of how the part should be attached to the PCB.
POWER MANAGEMENT
In some cases the AD9514 can be configured to use less power by turning off functions that are not being used. The power-saving options include the following: * * * Any divider is powered down when set to divide = 1 (bypassed). Adjustable delay block on OUT2 is powered down when in off mode (S0 = 0). In some cases, an unneeded output can be powered down (see Table 11). This also powers down the divider for that output.
VIAS TO GND PLANE
Figure 34. PCB Land for Attaching Exposed Paddle
05596-035
Rev. 0 | Page 24 of 28
AD9514 APPLICATIONS
USING THE AD9514 OUTPUTS FOR ADC CLOCK APPLICATIONS
Any high speed, analog-to-digital converter (ADC) is extremely sensitive to the quality of the sampling clock provided by the user. An ADC can be thought of as a sampling mixer, and any noise, distortion, or timing jitter on the clock is combined with the desired signal at the A/D output. Clock integrity requirements scale with the analog input frequency and resolution, with higher analog input frequency applications at 14-bit resolution being the most stringent. The theoretical SNR of an ADC is limited by the ADC resolution and the jitter on the sampling clock. Considering an ideal ADC of infinite resolution where the step size and quantization error can be ignored, the available SNR can be expressed approximately by
Many high performance ADCs feature differential clock inputs to simplify the task of providing the required low jitter clock on a noisy PCB. (Distributing a single-ended clock on a noisy PCB can result in coupled noise on the sample clock. Differential distribution has inherent common-mode rejection that can provide superior clock performance in a noisy environment.) The AD9514 features both LVPECL and LVDS outputs that provide differential clock outputs, which enable clock solutions that maximize converter SNR performance. The input requirements of the ADC (differential or single-ended, logic level, termination) should be considered when selecting the best clocking/converter solution.
LVPECL CLOCK DISTRIBUTION
The low voltage, positive emitter-coupled, logic (LVPECL) outputs of the AD9514 provide the lowest jitter clock signals available from the AD9514. The LVPECL outputs (because they are open emitter) require a dc termination to bias the output transistors. The simplified equivalent circuit in Figure 31 shows the LVPECL output stage. In most applications, a standard LVPECL far-end termination is recommended, as shown in Figure 36. The resistor network is designed to match the transmission line impedance (50 ) and the switching threshold (VS - 1.3 V).
VS VS 50 127 127 VS
1 SNR = 20 x log 2f ATJ where fA is the highest analog frequency being digitized.
Tj is the rms jitter on the sampling clock.
Figure 35 shows the required sampling clock jitter as a function of the analog frequency and effective number of bits (ENOB).
110 100 90 80 SNR (dB) 70 60 50
10p s TJ = 100 fS 200
1 SNR = 20log 2f T AJ
18
16
14 ENOB
fS fS
400 1ps 2ps
12
LVPECL
SINGLE-ENDED (NOT COUPLED) 50
LVPECL
10
8
05596-091
40 6 30 10 100 1k
Figure 36. LVPECL Far-End Termination
fA FULL-SCALE SINE WAVE ANALOG FREQUENCY (MHz)
VS 0.1nF 100 DIFFERENTIAL 100 (COUPLED)
VS
Figure 35. ENOB and SNR vs. Analog Input Frequency
See Application Notes AN-756 and AN-501 at www.analog.com.
LVPECL
0.1nF 200
LVPECL
Figure 37. LVPECL with Parallel Transmission Line
Rev. 0 | Page 25 of 28
05596-031
200
05596-030
VT = VS - 1.3V
83
83
AD9514
LVDS CLOCK DISTRIBUTION
The AD9514 provides one clock output (OUT2) that is selectable as either CMOS or LVDS levels. Low voltage differential signaling (LVDS) is a differential output option for OUT2. LVDS uses a current mode output stage. The current is 3.5 mA, which yields 350 mV output swing across a 100 resistor. The LVDS output meets or exceeds all ANSI/TIA/EIA644 specifications. A recommended termination circuit for the LVDS outputs is shown in Figure 38.
VS VS
Termination at the far end of the PCB trace is a second option. The CMOS outputs of the AD9514 do not supply enough current to provide a full voltage swing with a low impedance resistive, far-end termination, as shown in Figure 40. The far-end termination network should match the PCB trace impedance and provide the desired switching point. The reduced signal swing may still meet receiver input requirements in some applications. This can be useful when driving long trace lengths on less critical nets.
VS 50 100 3pF
05596-034
10 CMOS
LVDS
100 100 DIFFERENTIAL (COUPLED)
OUT2/OUT2B SELECTED AS CMOS
LVDS
100
05596-032
Figure 40. CMOS Output with Far-End Termination
Figure 38. LVDS Output Termination
See Application Note AN-586 at www.analog.com for more information on LVDS.
CMOS CLOCK DISTRIBUTION
The AD9514 provides one output (OUT2) that is selectable as either CMOS or LVDS levels. When selected as CMOS, this output provides for driving devices requiring CMOS level logic at their clock inputs. Whenever single-ended CMOS clocking is used, some of the following general guidelines should be used. Point-to-point nets should be designed such that a driver has only one receiver on the net, if possible. This allows for simple termination schemes and minimizes ringing due to possible mismatched impedances on the net. Series termination at the source is generally required to provide transmission line matching and/or to reduce current transients at the driver. The value of the resistor is dependent on the board design and timing requirements (typically 10 to 100 is used). CMOS outputs are also limited in terms of the capacitive load or trace length that they can drive. Typically, trace lengths less than 3 inches are recommended to preserve signal rise/fall times and preserve signal integrity.
10 CMOS MICROSTRIP
05596-033
Because of the limitations of single-ended CMOS clocking, consider using differential outputs when driving high speed signals over long traces. The AD9514 offers both LVPECL and LVDS outputs that are better suited for driving long traces where the inherent noise immunity of differential signaling provides superior performance for clocking converters.
SETUP PINS (S0 TO S10)
The setup pins that require a logic level of VS (internal selfbias) should be tied together and bypassed to ground via a capacitor. The setup pins that require a logic level of VS should be tied together, along with the VREF pin, and bypassed to ground via a capacitor.
POWER AND GROUNDING CONSIDERATIONS AND POWER SUPPLY REJECTION
Many applications seek high speed and performance under less than ideal operating conditions. In these application circuits, the implementation and construction of the PCB is as important as the circuit design. Proper RF techniques must be used for device selection, placement, and routing, as well as power supply bypassing and grounding to ensure optimum performance.
60.4 1.0 INCH
5pF GND
Figure 39. Series Termination of CMOS Output
Rev. 0 | Page 26 of 28
AD9514
PHASE NOISE AND JITTER MEASUREMENT SETUPS
WENZEL OSCILLATOR EVALUATION BOARD ZFL1000VH2
AD9514
BALUN
OUT1 CLK1 OUT1B
TERM
+28dB
SPLITTER ZESC-2-11
0
EVALUATION BOARD
AD9514
BALUN
OUT1 CLK1 OUT1B
ZFL1000VH2 TERM TERM AMP +28dB ATTENUATOR -7dB VARIABLE DELAY COLBY PDL30A 0.01ns STEP TO 10ns REF IN
AGILENT E5500B PHASE NOISE MEASUREMENT SYSTEM
05596-042
05596-041
TERM
AMP
ATTENUATOR -12dB
SIG IN
Figure 41. Additive Phase Noise Measurement Configuration
WENZEL OSCILLATOR
EVALUATION BOARD WENZEL OSCILLATOR
ANALOG SOURCE PC
AD9514
BALUN
OUT1 CLK1 OUT1B
TERM TERM
CLK
ADC FFT
SNR
tJ_RMS
DATA CAPTURE CARD FIFO
Figure 42. Jitter Determination by Measuring SNR of ADC
t J_RMS =
where:
V A_RMS - SND x BW 2 - QUANTIZATION 2 + THERMAL 2 + DNL 2 SNR 10 20 2 2 x f A x V A_PK
2
(
)(
)
[
]
tj_RMS is the rms time jitter. SNR is the signal-to-noise ratio. SND is the source noise density in nV/Hz. BW is the SND filter bandwidth. VA is the analog source voltage. fA is the analog frequency.
The terms are the quantization, thermal, and DNL errors.
Rev. 0 | Page 27 of 28
AD9514 OUTLINE DIMENSIONS
5.00 BSC SQ 0.60 MAX 0.60 MAX
25 24 32 1
PIN 1 INDICATOR
PIN 1 INDICATOR TOP VIEW 4.75 BSC SQ
0.50 BSC
EXPOSED PAD (BOTTOM VIEW)
17 16 8
3.25 3.10 SQ 2.95
0.50 0.40 0.30 0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM SEATING PLANE 0.30 0.23 0.18 0.20 REF
9
0.25 MIN 3.50 REF
12 MAX
1.00 0.85 0.80
COPLANARITY 0.08
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 43. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 5 mm x 5 mm Body, Very Thin Quad (CP-32-2) Dimensions shown in millimeters
ORDERING GUIDE
Model AD9514BCPZ 1 AD9514BCPZ-REEL71 AD9514/PCB
1
Temperature Range -40C to +85C -40C to +85C
Package Description 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) Evaluation Board
Package Option CP-32-2 CP-32-2
Z = Pb-free part.
(c) 2005 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D05596-0-7/05(0)
Rev. 0 | Page 28 of 28

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